The **ATS-13F-100-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ### 1. Technical Specifications The part number follows a specific nomenclature used by ATS. Below are the key characteristics: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Thermal Resistance** | 4.84°C/W (at 1.0 m/s airflow) | | **Dimensions (L x W)** | 45mm x 45mm | | **Height** | 25mm | | **Pin Pitch** | 3.5mm | --- ### 2. Physical Design Features * **XC Cut (Cross-Cut):** This model features a cross-cut fin design. Unlike straight fins, cross-cut fins allow for multi-directional airflow, making it highly effective in compact enclosures where air may not move in a single linear path. * **pushPIN™ Attachment:** Instead of messy adhesives or simple clips, this uses a specialized push-pin system with a built-in spring. This ensures consistent pressure (clamping force) on the electronic component for optimal heat transfer. * **Thermal Interface Material (TIM):** This specific model typically comes pre-applied with **T766** thermal phase-change material or a similar high-performance pad, ensuring a low-resistance path between the chip and the aluminum. --- ### 3. Thermal Performance Data Performance varies based on the velocity of the air moving through the fins (measured in Linear Feet per Minute - LFM): | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (Unducted) | 4.84 | | 300 (Unducted) | 1.87 | | 500 (Unducted) | 1.35 | --- ### 4. Applications This part is commonly used in: 1. **Telecommunications:** Cooling high-speed processors in routers and switches. 2. **Industrial Computing:** Maintaining temperatures in embedded PC systems. 3. **Power Electronics:** Dissipating heat from MOSFETs or IGBTs in power conversion modules.