ATS-13F-11-C2-R0
AI

The **ATS-13F-11-C2-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) push-pin heat sink**. It is designed to dissipate heat from surface-mount components like CPUs, GPUs, or FPGAs.
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### 1. Technical Specifications
The part number follows a specific nomenclature used by Advanced Thermal Solutions. Below is the breakdown of its physical and thermal characteristics:
| Feature | Specification |
| :--- | :--- |
| **Material** | Aluminum (Blue Anodized) |
| **Attachment Method** | Push-Pin (Plastic) |
| **Fin Type** | XC-Cut (Cross-cut) |
| **Dimensions (L x W x H)** | 50mm x 50mm x 10mm |
| **Thermal Resistance** | 18.78°C/W (at 1.0 m/s airflow) |
| **TIM (Thermal Interface Material)** | T766 (Pre-applied) |
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### 2. Key Components & Design Features
#### A. XC-Cut Fin Design
The "XC-Cut" refers to the straight fin pattern that has been cross-cut. This design:
* Allows for **multi-directional airflow**, making it effective regardless of how the cooling fan is oriented.
* Increases surface area for heat exchange without significantly increasing the footprint.
#### B. Push-Pin Attachment Mechanism
This part uses a spring-loaded push-pin system.
* **Ease of Assembly:** It allows for quick installation onto a PCB.
* **Consistent Pressure:** The springs ensure a precise amount of downward force, which is critical for the effectiveness of the thermal interface material.
#### C. Thermal Interface Material (TIM)
The model comes with **T766** pre-applied to the base.
* This is a phase-change or high-performance pad that fills microscopic air gaps between the component and the heat sink.
* It ensures maximum heat transfer efficiency from the silicon chip to the aluminum fins.
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### 3. Application Use Cases
This specific heat sink is typically used in:
* **Networking Hardware:** High-speed routers and switches.
* **Industrial PCs:** Compact systems requiring passive or low-airflow cooling.
* **Power Supplies:** Cooling voltage regulators or power transistors.
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### 4. Part Number Breakdown (Example)
To understand variations of this part, here is how the code is structured:
`ATS` (Brand) - `13` (Series) `F` (Fin style) - `11` (Size/Height code) - `C2` (Material/Color) - `R0` (Revision)
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What are the PCB hole diameter requirements for the push-pins used in this model?
- ⤷ How does the thermal resistance change if the airflow increases to 2.0 m/s?
- ⤷ Can the pre-applied T766 TIM be replaced with custom thermal paste?