The **ATS-13F-110-C2-R1** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **pushPIN™** series, designed for secure and efficient cooling of electronic integrated circuits (ICs). --- ### 1. Technical Specifications The part number encodes specific physical and thermal characteristics: | Parameter | Specification | | :--- | :--- | | **Series** | pushPIN™ | | **Attachment Type** | Push Pin (with Springs) | | **Material** | Aluminum (Blue Anodized) | | **Dimensions (L x W)** | 54.00 mm x 54.00 mm | | **Height (Fin)** | 25.00 mm | | **Pitch** | XC (Extra Coarse / Specific Fin Layout) | | **Thermal Resistance** | ~2.69 °C/W (at 100 LFM) | --- ### 2. Key Component Features #### A. Attachment Mechanism * **Push Pin:** This part uses a specialized push-pin mechanism instead of thermal adhesive. This provides a more reliable mechanical connection that can withstand vibration and thermal expansion. * **Brass Springs:** The "R1" designation typically refers to the hardware kit, including high-tension springs that ensure consistent pressure between the heat sink and the processor. #### B. Thermal Performance The heat sink is designed for **active or passive airflow**. The fin geometry is optimized to maximize surface area while minimizing pressure drop across the component. * **C2 Rating:** This indicates the use of **T766 thermal interface material (TIM)**, a high-performance thermal grease pre-applied to the base for immediate installation. #### C. Material and Coating * **Aluminum 6063:** Chosen for its excellent thermal conductivity and lightweight properties. * **Blue Anodized Finish:** Provides corrosion resistance and slightly improves radiative heat transfer. --- ### 3. Application Use Cases This specific model is frequently found in: 1. **Telecommunications:** Cooling of high-speed networking chips. 2. **Power Electronics:** Dissipating heat from MOSFETs or Power Modules. 3. **Industrial Computing:** Used on Motherboards or Single Board Computers (SBCs) where mechanical stability is required. --- ### 4. Dimensional Drawing Summary ```text 54.00 mm (Width) <--------------> +--------------+ ^ | | | | [Push Pin] | | 54.00 mm (Length) | | | +--------------+ v Height: 25.00 mm ``` ---