The **ATS-13F-112-C2-R1** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "pushPIN™" series, designed for cooling integrated circuits (ICs) and other electronic surface-mount components. --- ### 1. Key Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal properties: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Type** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W)** | 35.00 mm x 35.00 mm | | **Height** | 12.70 mm | | **Pitch** | COARSE-PITCH (Straight Fin) | | **Thermal Resistance** | 26.30 °C/W (Unducted Flow @ 100 LFM) | --- ### 2. Functional Components This part consists of three primary electronic-mechanical sub-components: * **The Heat Sink Body:** Made of Aluminum 6063, which offers high thermal conductivity. The "COARSE-PITCH" design features straight fins that allow for optimal airflow in environments where air is moving at lower velocities. * **The pushPIN™ Mechanism:** Instead of using messy adhesives or weak thermal tape, this part uses a brass push-pin with a stainless steel spring. This ensures consistent pressure (compression) on the chip, which is vital for efficient heat transfer. * **Thermal Interface Material (TIM):** The part usually comes pre-applied with **T766** thermal phase-change material or grease, ensuring there are no air gaps between the component (CPU/GPU/FPGA) and the heat sink. --- ### 3. Thermal Performance Data Performance varies based on the airflow (measured in Linear Feet per Minute - LFM): | Velocity (LFM) | Velocity (m/s) | Resistance (Unducted) | Resistance (Ducted) | | :--- | :--- | :--- | :--- | | 100 | 0.5 | 26.30 °C/W | 4.42 °C/W | | 200 | 1.0 | 13.91 °C/W | 3.62 °C/W | | 500 | 2.5 | 5.83 °C/W | 2.51 °C/W | --- ### 4. Application and Use Case The ATS-13F-112-C2-R1 is commonly used in: 1. **Telecommunications:** Cooling small processors in routers or switches. 2. **Embedded Systems:** Protecting PCBs from overheating in enclosed industrial boxes. 3. **Power Electronics:** Managing heat for voltage regulators and power MOSFETs.