The **ATS-13F-116-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **maxiFLOW™** series, designed to provide high thermal performance in restricted airflow environments. --- ### 1. Technical Specifications The part number encodes specific physical and thermal characteristics as detailed in the table below: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Series** | maxiFLOW™ | | **Material** | Aluminum (Black Anodized) | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance (Flowing)** | 4.14°C/W @ 100 LFM (Linear Feet per Minute) | | **Thermal Resistance (Static)** | 2.50°C/W @ 200 LFM | | **Dimensions (L x W x H)** | 54.00mm x 54.00mm x 30.00mm | --- ### 2. Physical Components & Design The ATS-13F-116-C2-R0 consists of several key electronic cooling elements: #### A. The Heat Sink Body * **maxiFLOW™ Profile:** Features a unique "flared" fin geometry. This design increases the surface area while reducing the pressure drop, allowing more air to flow through the fins rather than around them. * **Material:** Extruded aluminum, which provides a balance between weight, cost, and high thermal conductivity. #### B. The pushPIN™ Attachment System Instead of simple adhesive tape, this model uses a mechanical **pushPIN™** system: * **Brass Components:** The pins are often made of brass for durability. * **Compression Springs:** These ensure a consistent and precise pressure is applied to the electronic component (CPU, GPU, or ASIC). This "Pre-Assembled" pressure optimizes the interface between the chip and the sink. #### C. Thermal Interface Material (TIM) * The part usually comes pre-applied with **ATS-CPX**, a high-performance phase-change thermal material or grease, ensuring there are no air gaps between the component and the heat sink. --- ### 3. Ideal Applications This specific part is used in electronics where heat dissipation is critical for longevity and performance: 1. **Telecommunications:** Network switches and high-speed routers. 2. **Computing:** Embedded processors and specialized ASICs. 3. **Power Electronics:** Cooling of large transistors or power modules. ---