The **ATS-13F-12-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions, Inc. (ATS)*. It is part of the push-pin attachment series designed for cooling electronic components like CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of this part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Part Number** | ATS-13F-12-C2-R0 | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Brass) | | **Dimensions (L x W)** | 50mm x 50mm | | **Height (H)** | 12.7mm | | **Fin Style** | XCUT (Cross-Cut) | | **Thermal Resistance** | ~15.8°C/W (at 100 LFM) to ~2.1°C/W (at 800 LFM) | --- ### 2. Design and Engineering Features #### A. XCUT Fin Pattern The "XCUT" geometry refers to a cross-cut fin design. Unlike straight-fin heat sinks, the cross-cut pattern allows for: * **Omnidirectional Airflow:** It can accept cooling air from any direction, making it ideal for enclosures with complex or unpredictable internal airflow. * **Increased Surface Area:** The cuts increase the total surface area available for convection without significantly increasing the footprint. #### B. Push-Pin Attachment Mechanism This part uses a pre-assembled brass push-pin with a compression spring. * **Standardized Holes:** It requires specific PCB hole patterns (usually 3.0mm diameter holes). * **Consistent Pressure:** The spring ensures a constant, high-pressure contact between the heat sink and the component, optimizing thermal transfer through the interface material. #### C. Thermal Interface Material (TIM) The "C2" in the part number indicates that it comes pre-applied with **ATS-PPS-12**, a high-performance thermal phase-change material or tape. This eliminates the need for manual application of thermal paste during assembly. --- ### 3. Part Number Breakdown Understanding the nomenclature helps in identifying variants: | Segment | Meaning | | :--- | :--- | | **ATS** | Advanced Thermal Solutions (Brand) | | **13** | Series identifier (Fin height/density category) | | **F** | Fine Pitch / Specific geometry code | | **12** | Height in millimeters (approx. 12.7mm) | | **C2** | Thermal Interface Material (TIM) type | | **R0** | RoHS Compliant / Revision status | --- ### 4. Typical Applications * **Embedded Computing:** Cooling high-speed processors in industrial PCs. * **Telecommunications:** Cooling ASICs in routers and switches. * **Power Electronics:** Managing heat for large MOSFET arrays or power modules.