The **ATS-13F-128-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **maxiFLOW™** series, designed to provide low thermal resistance and high airflow efficiency for cooling electronic components like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications Below are the key technical details for this specific part number: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum (with Blue Anodized finish) | | **Base Dimensions** | 54.00mm x 54.00mm | | **Height** | 25.00mm | | **Attachment Method** | pushPIN™ (Brass pins / Plastic pins) | | **Fin Style** | maxiFLOW (Tapered Fin Design) | | **Thermal Resistance** | ~2.90°C/W (at 100 LFM) | | **Compliance** | RoHS Compliant | --- ### 2. Physical Design Features The "ATS-13F-128-C2-R0" features specific engineering choices to maximize cooling: * **maxiFLOW™ Geometry:** The fins are tapered and spread outward. This design reduces pressure drop and increases the surface area exposed to moving air, making it more efficient than standard straight-fin heat sinks. * **pushPIN™ Attachment:** It utilizes a specialized spring-loaded pin system. This ensures even pressure across the component (improving thermal contact) and makes installation faster and more secure than simple adhesive tapes. * **C2 Material/Finish:** The "C2" suffix typically denotes the use of **Blue Anodized** aluminum. This finish is not just for aesthetics; it provides corrosion resistance and slightly improves radiative heat transfer. --- ### 3. Part Number Breakdown Understanding the nomenclature helps identify the specific variant: | Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer (Advanced Thermal Solutions) | | **13F** | Series/Mounting Type (pushPIN™ style) | | **128** | Specific physical dimensions/fin configuration | | **C2** | Thermal Interface Material (TIM) and Finish (Blue Anodized) | | **R0** | Revision code | --- ### 4. Application Use Cases This heat sink is commonly used in high-density electronic environments where space is limited but thermal output is high: * **Networking Hardware:** Routers, switches, and high-speed gateways. * **Embedded Systems:** Industrial PCs and controllers. * **Power Supplies:** Cooling MOSFETs or power regulators.