The **ATS-13F-134-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the **pushPIN™** series, designed to provide efficient cooling for electronic components like CPUs, GPUs, and power modules. --- ### 1. Technical Specifications The part number encodes specific physical and thermal characteristics. Here is the breakdown: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Type** | pushPIN™ (Plastic Pegs with Springs) | | **Thermal Resistance (Flow)** | 4.44 °C/W @ 100 LFM | | **Dimensions (L x W x H)** | 70.00mm x 70.00mm x 25.00mm | | **Pitch (Hole to Hole)** | 63.00mm | | **Weight** | ~90 grams | --- ### 2. Key Features * **Thermal Performance:** Engineered with a specific fin density (fine pitch) to maximize surface area for air cooling. * **Push-Pin Mounting:** Uses a spring-loaded mechanism that ensures consistent pressure on the component, improving thermal interface material (TIM) performance. * **Pre-Applied TIM:** Typically comes with a high-performance thermal interface material pre-applied to the base to simplify installation. * **Directional Airflow:** Designed for systems with forced-air cooling (fans). --- ### 3. Application Use Cases This heat sink is typically found in the following electronic environments: 1. **Industrial Computing:** Cooling processors in automation controllers. 2. **Networking Equipment:** Managing heat in high-speed switches and routers. 3. **Power Electronics:** Dissipating heat from large MOSFET arrays or IGBTs. --- ### 4. Thermal Resistance Data Thermal performance varies based on the airflow (velocity) within the chassis: | Air Velocity (LFM) | 100 | 200 | 300 | 400 | 500 | | :--- | :--- | :--- | :--- | :--- | :--- | | **Unducted Flow (°C/W)** | 4.44 | 2.06 | 1.62 | 1.41 | 1.28 | | **Ducted Flow (°C/W)** | 1.78 | 1.31 | 1.12 | 1.01 | 0.93 |