The **ATS-13F-14-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the **pushPIN™** line, designed for cooling electronic components such as processors, FPGAs, and GPUs. --- ## 1. Technical Specifications Below is a breakdown of the physical and thermal properties of this specific component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Type** | pushPIN™ (Spring-loaded) | | **Dimensions (LxWxH)** | 50mm x 50mm x 20mm | | **Thermal Resistance** | 9.97 °C/W (at 100 LFM) | | **Flow Pattern** | Fine-Pitch (Straight Fin) | | **Spring/Pin Type** | ATS-PP-06 (Plastic or Brass) | --- ## 2. Key Components & Construction The ATS-13F-14-C2-R0 consists of three primary electronic cooling elements: ### A. The Heat Sink Body * **Straight Fin Design:** Uses a specific fin density to optimize airflow from a cooling fan. * **Material:** The 6063 aluminum alloy provides a high thermal conductivity-to-weight ratio. * **Blue Anodized Coating:** Provides corrosion resistance and slightly improves radiative heat transfer. ### B. The pushPIN™ Attachment Mechanism Instead of adhesive or simple clips, this model uses a **spring-loaded pushpin system**. * **Pre-drilled Holes:** Designed for a specific PCB hole pattern (43mm spacing). * **Compression Springs:** These ensure consistent pressure (TIM - Thermal Interface Material) against the chip for maximum heat transfer. ### C. Thermal Interface Material (TIM) * The part usually comes with a pre-applied high-performance **T766 phase-change material** or thermal grease. This fills the microscopic air gaps between the component and the heat sink. --- ## 3. Performance Data Thermal resistance decreases as the airflow (Measured in Linear Feet per Minute - LFM) increases: | Airflow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 100 | 0.5 | 9.97 | | 300 | 1.5 | 3.28 | | 500 | 2.5 | 2.15 | | 700 | 3.5 | 1.68 | --- ## 4. Usage Considerations * **PCB Footprint:** Ensure your PCB has the required 43mm x 43mm hole spacing. * **Component Height:** The 20mm height is "low-profile," making it suitable for 1U server chassis or compact embedded systems. * **Airflow Direction:** Because it is a straight-fin design, it is most effective when airflow is directed parallel to the fins.