The **ATS-13F-162-C2-R0** is a high-performance electronic thermal management component, specifically a **push-pin heat sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from surface-mount components like CPUs, GPUs, or FPGAs. --- ### 1. Key Technical Specifications The part number encodes specific physical and thermal characteristics: | Feature | Specification | | :--- | :--- | | **Part Family** | pushPIN™ Heat Sink | | **Attachment Type** | Push-Pin (Plastic or Brass) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance** | 3.62 °C/W (at 100 LFM) | | **Dimensions (L x W x H)** | 45mm x 45mm x 25mm | | **Fin Pattern** | Fine Pitch (Straight Fin) | | **Interface Material** | T766 (Thermal Phase Change Material) | --- ### 2. Physical Components This assembly consists of three primary electronic-mechanical parts: 1. **Heat Sink Body:** A 45mm square aluminum block with vertical fins. The high fin density increases the surface area, allowing for efficient heat transfer into the surrounding air. 2. **Push-Pin Mechanism:** Uses a spring-loaded pin system. This ensures even pressure across the component surface, which is critical for maintaining a consistent thermal bond. 3. **Thermal Interface Material (TIM):** The "C2" in the part number indicates it comes pre-applied with **T766**, a high-performance thermal pad/paste that fills microscopic air gaps between the heat source and the metal sink. --- ### 3. Thermal Performance Profile The effectiveness of this part depends heavily on the airflow (LFM - Linear Feet per Minute) within the electronic enclosure: | Airflow Velocity | Thermal Resistance (Unducted) | | :--- | :--- | | **100 LFM (0.5 m/s)** | 3.62 °C/W | | **300 LFM (1.5 m/s)** | 2.13 °C/W | | **500 LFM (2.5 m/s)** | 1.71 °C/W | | **700 LFM (3.5 m/s)** | 1.48 °C/W | --- ### 4. Typical Applications * **Networking Gear:** Switches and routers where high-speed processors generate significant heat. * **Industrial PCs:** Used on motherboards where vibration resistance (provided by the push-pins) is necessary. * **Power Supplies:** Cooling MOSFETs or power regulators.