The **ATS-13F-169-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **pushPIN™** series, designed for efficient cooling of integrated circuits (ICs) and other surface-mount components. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of the part: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum (Blue Anodized) | | **Dimensions** | 25mm x 25mm x 10mm | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Fin Style** | Fine-Pitch (Cross-Cut) | | **Thermal Resistance (Unducted)** | 15.71 °C/W @ 100 LFM | | **Thermal Resistance (Ducted)** | 6.67 °C/W @ 100 LFM | | **Hardware included** | ATS-HK176-R0 (Springs and Pins) | --- ### 2. Breakdown of the Part Number The alphanumeric code provides specific details about the configuration: * **ATS**: Manufacturer (Advanced Thermal Solutions). * **13**: Series identifier (pushPIN™ Heat Sink). * **F**: Fin material/type (typically Aluminum). * **169**: Designator for the footprint and fin pattern. * **C2**: Thermal Interface Material (TIM). "C2" usually indicates **T766**, a high-performance phase-change material or thermal grease. * **R0**: Revision/Packaging code. --- ### 3. Key Electronic Functions While the heat sink itself is passive (no moving parts), it serves critical functions in electronic systems: 1. **Heat Dissipation:** It increases the surface area of a hot component (like a CPU, FPGA, or MOSFET), allowing air to carry away heat more effectively. 2. **Thermal Protection:** By maintaining the junction temperature ($T_j$) within safe limits, it prevents "thermal throttling" or permanent hardware failure. 3. **Mechanical Attachment:** The use of **pushPIN™** technology ensures a secure, consistent pressure on the electronic chip, which optimizes the contact between the chip and the thermal interface material. --- ### 4. Installation Geometry The mounting holes are a critical factor for PCB design when using this part: ```text Pitch Layout: (O) --------- 30mm --------- (O) | | | [25mm] | 30mm Heatsink 30mm | Center | | | (O) --------- 30mm --------- (O) ``` *Note: The pitch for the mounting holes for this specific model is typically 30mm x 30mm.*