The **ATS-13F-170-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ HS Assembly | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance** | 5.44°C/W (at 100 LFM) | | **Attachment Method** | Push-Pin (Plastic) | | **Spring Type** | ATS-HK176-R0 | --- ### 2. Physical Dimensions The "170" in the part number corresponds to specific sizing parameters in the ATS catalog. * **Size (L x W):** 25mm x 25mm * **Height:** 25mm * **Fin Style:** Straight (designed for directional airflow) * **Pitch:** Fine pitch for high-density surface area. --- ### 3. Key Electronic Components & Features #### A. Thermal Interface Material (TIM) This specific model usually comes pre-applied with **T766**, a high-performance thermal phase-change material. This ensures there are no air gaps between the semiconductor die and the aluminum base, maximizing heat transfer. #### B. The pushPIN™ Attachment System Instead of using messy adhesives or bulky clips, this part utilizes a spring-loaded push-pin system. * **Reliability:** Provides consistent pressure (clamping force) to the electronic component. * **Installation:** Requires pre-drilled holes in the PCB (Printed Circuit Board). * **Shock/Vibration:** The springs help absorb mechanical stress, protecting the solder joints of the BGA (Ball Grid Array) component underneath. #### C. Blue Anodized Finish The blue coating is not just for aesthetics. Anodization increases the surface emissivity, slightly improving radiant heat transfer, and provides a non-conductive protective layer to prevent oxidation and electrical shorts if a tool touches the sink. --- ### 4. Application Use-Case This part is typically used in: 1. **Telecommunications:** Cooling small processors in routers or switches. 2. **Embedded Systems:** Industrial PCs where space is limited but vertical height (25mm) is available. 3. **Power Supplies:** Cooling voltage regulators that generate significant heat in a small footprint.