The **ATS-13F-182-C1-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It is part of the "push-pin" series designed for cooling processors and integrated circuits. --- ### 1. Key Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Heat Sink Type** | Top Mount (Square Fin) | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | Push-Pin (Plastic) | | **Dimensions (L x W x H)** | 40mm x 40mm x 15mm | | **Thermal Resistance** | 7.48°C/W (at 200 LFM) | | **Thermal Interface Material (TIM)** | ATS-51 (Pre-applied) | --- ### 2. Physical Design & Composition The unit is engineered to maximize surface area within a small footprint to dissipate heat efficiently into the surrounding air. * **Fin Style:** It utilizes a **Square-Fin** pattern, which provides multi-directional airflow. This is ideal for systems where the airflow direction might be inconsistent or obstructed. * **Material:** Made from high-grade aluminum, it balances weight and thermal conductivity. The **Blue Anodized** finish is not just aesthetic; it protects the aluminum from corrosion and slightly improves emissivity. * **Thermal Interface (TIM):** The base comes pre-applied with **ATS-51**, a high-performance thermal pad/grease. This eliminates the need for manual application and ensures a bubble-free contact with the component (CPU/GPU/FPGA). --- ### 3. Attachment Mechanism: Push-Pin The "C1" in the part number signifies the specific attachment kit. 1. **Spring-Loaded Pins:** The heat sink is secured to the PCB using two plastic push-pins with integrated springs. 2. **Compression:** The springs provide precise, consistent pressure against the electronic component, ensuring maximum heat transfer without cracking the silicon die. 3. **Hole Patterns:** It requires two pre-drilled holes in the PCB, usually spaced specifically for the 40mm frame. --- ### 4. Performance Metrics (Airflow) The effectiveness of this part depends heavily on the Linear Feet per Minute (LFM) of airflow provided by system fans: | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | **200 (1.0 m/s)** | 7.48 | | **400 (2.0 m/s)** | 3.66 | | **600 (3.0 m/s)** | 2.89 | --- ### 5. Common Applications * **Embedded Systems:** Cooling SoCs (System on Chips). * **Networking:** Routers, switches, and high-speed modems. * **Power Supplies:** Cooling voltage regulators or power transistors. * **Industrial PCs:** Compact computing modules where vertical space is limited to 15mm.