The **ATS-13F-187-C2-R0** is a high-performance **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** series, designed specifically for cooling electronic components like CPUs, GPUs, and FPGAs where airflow is directed. --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of this specific part: | Parameter | Specification | | :--- | :--- | | **Product Series** | maxiFLOW™ | | **Material** | Aluminum (Black Anodized) | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W x H)** | 45mm x 45mm x 10mm | | **Thermal Resistance** | 2.72°C/W (at 200 LFM) | | **Flow Pattern** | Spread Fin (Optimized for directional airflow) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Key Electronic Components & Design Features #### A. Fin Geometry (maxiFLOW™) Unlike standard straight-fin heat sinks, the ATS-13F-187-C2-R0 uses a **graduated fin profile**. The fins spread outwards to maximize the surface area and reduce pressure drop, allowing air to circulate more effectively around the electronic package. #### B. pushPIN™ Attachment This part uses a specialized mounting system: * **Precision Springs:** Ensure even pressure across the electronic component to maximize heat transfer. * **Nylon Bolts:** These provide a secure mechanical connection to the PCB, preventing the heat sink from shifting during vibration or shipping. #### C. Thermal Interface Material (TIM) The base comes pre-applied with **T766**. This is a high-performance phase-change material that fills the microscopic air gaps between the heat sink base and the electronic chip, significantly lowering the contact resistance. --- ### 3. Typical Applications This component is generally used to cool high-density electronic modules, including: * **Telecommunications:** Network switches and routers. * **Computing:** High-speed memory modules or localized voltage regulators. * **Embedded Systems:** Industrial PC processors where space is limited but thermal loads are high. ---