ATS-13F-188-C2-R0
AI

The **ATS-13F-188-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink**, manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "push pin" series designed for securing cooling solutions to PCBs.
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### 1. Technical Specifications
Below are the primary technical parameters for this specific part number:
| Parameter | Specification |
| :--- | :--- |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | Push-Pin (Brass) |
| **Thermal Resistance** | 6.67°C/W @ 100 LFM |
| **Dimensions (L x W x H)** | 45mm x 45mm x 15mm |
| **Fin Style** | Fine Pitch (XC Cut) |
| **Pressure Spring** | R0 (Standard tension) |
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### 2. Breakdown of the Part Number
The part number follows a specific nomenclature used by Advanced Thermal Solutions:
* **ATS-13**: Refers to the "maxiFLOW™" or specific push-pin heat sink family.
* **F**: Indicates the attachment hole pattern or specific fin configuration.
* **188**: A size code representing the physical footprint (45mm x 45mm).
* **C2**: Indicates the material/finish (Aluminum with Blue Anodized coating).
* **R0**: Refers to the assembly version, specifically the spring tension and pin type.
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### 3. Key Electronic Functions
While the heat sink does not contain circuitry, it is critical for the stability of electronic systems:
* **Heat Dissipation:** Conducts thermal energy away from high-power components like CPUs, GPUs, FPGAs, or power MOSFETs.
* **Mechanical Stability:** The push-pin mechanism uses a spring-loaded design to ensure constant pressure on the thermal interface material (TIM), preventing gaps caused by vibration or thermal expansion.
* **Airflow Optimization:** The XC Cut (cross-cut) design allows for multi-directional airflow, making it effective in systems where air direction might change or be turbulent.
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### 4. Implementation Example
To use this in a PCB design, the layout must include two specifically spaced holes to accommodate the brass push-pins.
```markdown
PCB Layout Requirements:
1. Hole Diameter: ~3.0mm to 3.2mm
2. Hole Pitch: 38.0mm (Standard for the 45mm footprint)
3. Component Clearance: 45mm x 45mm exclusion zone
```
- ⤷
What are the different types of thermal interface materials (TIM) recommended for this heat sink?
- ⤷ How does the 'Blue Anodized' finish affect thermal performance compared to bare aluminum?
- ⤷ What is the difference between push-pin and bolt-on attachment methods for heat sinks?