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  • ATS-13F-188-C2-R0

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    The **ATS-13F-188-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink**, manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "push pin" series designed for securing cooling solutions to PCBs. --- ### 1. Technical Specifications Below are the primary technical parameters for this specific part number: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Brass) | | **Thermal Resistance** | 6.67°C/W @ 100 LFM | | **Dimensions (L x W x H)** | 45mm x 45mm x 15mm | | **Fin Style** | Fine Pitch (XC Cut) | | **Pressure Spring** | R0 (Standard tension) | --- ### 2. Breakdown of the Part Number The part number follows a specific nomenclature used by Advanced Thermal Solutions: * **ATS-13**: Refers to the "maxiFLOW™" or specific push-pin heat sink family. * **F**: Indicates the attachment hole pattern or specific fin configuration. * **188**: A size code representing the physical footprint (45mm x 45mm). * **C2**: Indicates the material/finish (Aluminum with Blue Anodized coating). * **R0**: Refers to the assembly version, specifically the spring tension and pin type. --- ### 3. Key Electronic Functions While the heat sink does not contain circuitry, it is critical for the stability of electronic systems: * **Heat Dissipation:** Conducts thermal energy away from high-power components like CPUs, GPUs, FPGAs, or power MOSFETs. * **Mechanical Stability:** The push-pin mechanism uses a spring-loaded design to ensure constant pressure on the thermal interface material (TIM), preventing gaps caused by vibration or thermal expansion. * **Airflow Optimization:** The XC Cut (cross-cut) design allows for multi-directional airflow, making it effective in systems where air direction might change or be turbulent. --- ### 4. Implementation Example To use this in a PCB design, the layout must include two specifically spaced holes to accommodate the brass push-pins. ```markdown PCB Layout Requirements: 1. Hole Diameter: ~3.0mm to 3.2mm 2. Hole Pitch: 38.0mm (Standard for the 45mm footprint) 3. Component Clearance: 45mm x 45mm exclusion zone ```
    ✨ Follow-up Questions
    • ⤷ What are the different types of thermal interface materials (TIM) recommended for this heat sink?
    • ⤷ How does the 'Blue Anodized' finish affect thermal performance compared to bare aluminum?
    • ⤷ What is the difference between push-pin and bolt-on attachment methods for heat sinks?