The **ATS-13F-189-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** series, designed to dissipate heat from integrated circuits (ICs) like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics: | Feature | Specification | | :--- | :--- | | **Component Type** | Passive Heat Sink | | **Material** | Aluminum (Black Anodized) | | **Dimensions** | 45.00mm x 45.00mm | | **Height** | 20.00mm | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Thermal Resistance** | 2.43°C/W @ 200 LFM (Linear Feet per Minute) | | **Thermal Interface** | T766 (Pre-applied thermal phase-change material) | --- ### 2. Key Electronic Features #### A. Fin Design (maxiFLOW™) Unlike standard straight-fin heat sinks, this part uses a **tapered fin design**. This maximizes the surface area for radiant cooling while minimizing the pressure drop, allowing air to flow more effectively through the fins even in high-density electronic enclosures. #### B. pushPIN™ Attachment The electronic assembly relies on a secure mechanical connection. The "R0" designation refers to the specific attachment kit which includes: * **Brass/Plastic Pins:** Ensure the heat sink stays mounted during vibrations or shipping. * **Compression Springs:** Provide precise downward pressure (TIM compression) to ensure maximum heat transfer from the silicon die to the aluminum base. #### C. Thermal Interface Material (TIM) The part comes with **T766** pre-applied to the base. In electronics, this is crucial because it fills microscopic air gaps between the component and the heat sink, significantly lowering the contact resistance. --- ### 3. Typical Applications This part is commonly found in the following electronic environments: * **Telecommunications:** Cooling high-speed network processors. * **Embedded Systems:** Thermal management for industrial motherboards. * **Power Supplies:** Dissipating heat from high-power MOSFETs or voltage regulators. ---