The **ATS-13F-202-C2-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) push-pin heat sink**. These parts are designed to dissipate heat from integrated circuits (ICs) like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of this specific part number: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Series** | pushPIN™ | | **Material** | Aluminum (Blue Anodized) | | **Thermal Resistance** | 14.83°C/W (Unducted Flow @ 100 LFM) | | **Dimensions (L x W)** | 54.00mm x 54.00mm | | **Height (Fin Depth)** | 15.00mm | | **Attachment Method** | Push-Pin (Plastic) | | **Thermal Interface Material** | T766 (Pre-applied) | --- ### 2. Breakdown of the Part Number The part number follows a specific nomenclature used by ATS to describe the component's geometry and mounting style: * **ATS:** Manufacturer (Advanced Thermal Solutions). * **13:** Indicates the specific fin pattern or series geometry. * **F:** Denotes the "Fine" pitch fin configuration. * **202:** Internal code for the specific dimension set ($54 \times 54 \times 15$ mm). * **C2:** Refers to the material and finish (Blue Anodized Aluminum). * **R0:** Revision code or packaging indicator. --- ### 3. Key Electronic Functions While the heat sink itself is passive (it does not use electricity), it is critical for the electronic health of a system: 1. **Thermal Dissipation:** It increases the surface area of a hot electronic component, allowing airflow (convection) to carry heat away more efficiently. 2. **Junction Temperature Control:** By lowering the operating temperature, it prevents "thermal throttling" in processors and extends the Mean Time Between Failures (MTBF) of the silicon. 3. **Mechanical Stability:** The push-pin mechanism uses a precise spring-loaded design to ensure a constant, even pressure across the die, which is vital for the effectiveness of the Thermal Interface Material (TIM). --- ### 4. Mounting and Compatibility This part is designed for PCBs with pre-drilled holes. The **push-pin and compression spring** system provides: * **Tool-less installation:** Snap-in assembly. * **Reliability:** Maintains contact even during high-vibration environments. * **Universal Hole Patterns:** Generally compatible with industry-standard pitch distances.