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  • ATS-13F-204-C2-R0

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    The **ATS-13F-204-C2-R0** is a high-performance **Heat Sink** manufactured by Advanced Thermal Solutions (ATS) as part of their **pushPIN™** series. These components are designed to dissipate heat from electronic integrated circuits (ICs) like CPUs, GPUs, or FPGAs. ### 1. Technical Specifications The following table outlines the physical and thermal properties of this specific model: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W)** | 54.00 mm x 54.00 mm | | **Height** | 12.00 mm | | **Pitch** | Fine-Pitch | | **Pattern** | XC-CUT | | **Thermal Resistance** | 7.43 °C/W (Unducted Flow @ 200 LFM) | --- ### 2. Key Component Features #### A. XC-CUT Fin Design The "XC-CUT" refers to a cross-cut fin pattern. Unlike straight fins, cross-cutting creates discrete pins/blocks. This increases the surface area and promotes air turbulence, which significantly improves heat transfer in environments where airflow direction might vary. #### B. PushPIN™ Attachment System This part uses a specific mechanical mounting system instead of thermal adhesive: * **Compression Springs:** Provide precise pressure to ensure optimal contact between the heat sink and the component. * **Brass/Plastic Pins:** Secure the assembly to the PCB through pre-drilled holes. #### C. Thermal Performance (Deg C/W) Thermal resistance indicates how efficiently the part moves heat away from the chip. Lower values are better. | Airflow Velocity (LFM) | 200 | 400 | 600 | 800 | | :--- | :--- | :--- | :--- | :--- | | **Resistance (Ducted)** | 3.39 | 2.52 | 2.13 | 1.89 | | **Resistance (Unducted)** | 7.43 | 5.23 | 4.38 | 3.84 | --- ### 3. Electronic Application This part is typically used in the following scenarios: 1. **High-Speed Networking:** Cooling switch fabrics or PHY chips. 2. **Power Electronics:** Dissipating heat from MOSFET arrays. 3. **Embedded Systems:** For industrial motherboards where vibration resistance (provided by the push-pins) is required over simple adhesive tape. ---
    ✨ Follow-up Questions
    • ⤷What is the difference between ducted and unducted thermal resistance?
    • ⤷ How do I determine if my PCB hole pattern is compatible with this heat sink?
    • ⤷ What are the advantages of blue anodized finishes on heat sinks?