ATS-13F-204-C2-R0
AI

The **ATS-13F-204-C2-R0** is a high-performance **Heat Sink** manufactured by Advanced Thermal Solutions (ATS) as part of their **pushPIN™** series. These components are designed to dissipate heat from electronic integrated circuits (ICs) like CPUs, GPUs, or FPGAs.
### 1. Technical Specifications
The following table outlines the physical and thermal properties of this specific model:
| Parameter | Specification |
| :--- | :--- |
| **Material** | Aluminum (AL6063) |
| **Finish** | Blue Anodized |
| **Attachment Method** | pushPIN™ (Spring-loaded) |
| **Dimensions (L x W)** | 54.00 mm x 54.00 mm |
| **Height** | 12.00 mm |
| **Pitch** | Fine-Pitch |
| **Pattern** | XC-CUT |
| **Thermal Resistance** | 7.43 °C/W (Unducted Flow @ 200 LFM) |
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### 2. Key Component Features
#### A. XC-CUT Fin Design
The "XC-CUT" refers to a cross-cut fin pattern. Unlike straight fins, cross-cutting creates discrete pins/blocks. This increases the surface area and promotes air turbulence, which significantly improves heat transfer in environments where airflow direction might vary.
#### B. PushPIN™ Attachment System
This part uses a specific mechanical mounting system instead of thermal adhesive:
* **Compression Springs:** Provide precise pressure to ensure optimal contact between the heat sink and the component.
* **Brass/Plastic Pins:** Secure the assembly to the PCB through pre-drilled holes.
#### C. Thermal Performance (Deg C/W)
Thermal resistance indicates how efficiently the part moves heat away from the chip. Lower values are better.
| Airflow Velocity (LFM) | 200 | 400 | 600 | 800 |
| :--- | :--- | :--- | :--- | :--- |
| **Resistance (Ducted)** | 3.39 | 2.52 | 2.13 | 1.89 |
| **Resistance (Unducted)** | 7.43 | 5.23 | 4.38 | 3.84 |
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### 3. Electronic Application
This part is typically used in the following scenarios:
1. **High-Speed Networking:** Cooling switch fabrics or PHY chips.
2. **Power Electronics:** Dissipating heat from MOSFET arrays.
3. **Embedded Systems:** For industrial motherboards where vibration resistance (provided by the push-pins) is required over simple adhesive tape.
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- ⤷What is the difference between ducted and unducted thermal resistance?
- ⤷ How do I determine if my PCB hole pattern is compatible with this heat sink?
- ⤷ What are the advantages of blue anodized finishes on heat sinks?