The **ATS-13F-33-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** series, designed to dissipate heat from electronic components like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications The following table highlights the core technical characteristics of the device: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Series** | maxiFLOW™ | | **Attachment Method** | pushPIN™ | | **Material** | Aluminum (Blue Anodized) | | **Thermal Resistance** | 17.50°C/W (Unducted Flow @ 100 LFM) | | **Dimensions** | 36.83mm x 36.83mm | | **Height** | 17.78mm | | **Thermal Interface Material (TIM)** | T412 (Pre-applied) | --- ### 2. Component Breakdown #### A. The maxiFLOW™ Design The heat sink features a unique spread-fin geometry. Unlike standard square fins, these fins maximize the surface area for convection while minimizing pressure drop. This is critical in high-density electronic enclosures where airflow might be restricted. #### B. pushPIN™ Attachment Instead of using messy adhesives or weak thermal tape, this part uses a **pushPIN™** system: * **Spring-loaded:** Ensures consistent pressure across the component surface for optimal thermal transfer. * **Hardware:** Includes brass or plastic pins and a stainless steel spring. * **Reliability:** Highly resistant to shock and vibration compared to "clip-on" alternatives. #### C. Thermal Interface Material (TIM) The unit comes pre-applied with **T412**, a high-efficiency thermal grease/pad. This fills the microscopic air gaps between the heat source (the chip) and the aluminum base, significantly reducing thermal resistance. --- ### 3. Part Number Decoder The part number **ATS-13F-33-C3-R0** provides specific build details: * **ATS:** Advanced Thermal Solutions (Brand). * **13:** Series/Body style. * **F:** Fin pitch/style. * **33:** Specific dimension/height code. * **C3:** Specific thermal performance/material grade. * **R0:** Revision code or packaging variant. --- ### 4. Ideal Applications * **Telecommunications:** Cooling network switches and routers. * **Embedded Computing:** Industrial PCs and small form factor boards. * **Power Supplies:** Dissipating heat from MOSFETs or voltage regulators.