The **ATS-13F-35-C3-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) Push-Pin Heat Sink**. It is designed to cool electronic components like CPUs, GPUs, or FPGAs in high-airflow environments. --- ### 1. Technical Specifications The part number encodes specific physical and thermal characteristics: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Anodized Blue) | | **Attachment Type** | Push-Pin (Spring-loaded) | | **Heat Sink Type** | XC-Cut (Cross-cut) | | **Dimensions** | 35mm x 35mm x 10mm | | **Thermal Resistance** | 12.58°C/W (Unducted Flow @ 200 LFM) | | **TIM (Interface Material)** | T412 (High Performance) | --- ### 2. Key Electronic Components Breakdown #### A. The Heat Sink Body (XC-Cut) The body is made of extruded aluminum. The "XC-Cut" refers to a cross-cut pattern that creates fine fins. This design is crucial for: * **Increased Surface Area:** Maximizing contact with air. * **Omnidirectional Airflow:** Allowing air to enter from any direction, which is ideal for crowded PCB layouts where airflow direction may vary. #### B. The Push-Pin Attachment Mechanism Instead of using adhesive tape, this part uses a mechanical push-pin system with a brass spring. * **Pressure Consistency:** The spring ensures a constant, specific downward force on the chip. * **Reliability:** Mechanical pins prevent the heat sink from shifting or falling off due to vibration or high heat (which can dry out adhesives). #### C. Thermal Interface Material (TIM) The base comes pre-applied with **T412** thermal grease. * **Function:** It fills microscopic air gaps between the heat sink base and the electronic component. * **Efficiency:** T412 is a high-performance material that ensures low thermal resistance for rapid heat transfer. --- ### 3. Application Use Cases This specific part is typically found in: 1. **Network Switches/Routers:** Cooling high-speed processing chips. 2. **Embedded Systems:** Industrial PCs where mechanical stability is required. 3. **Power Supplies:** Cooling MOSFETs or power regulators. --- ### 4. Thermal Performance Data Performance varies based on the velocity of the air (LFM - Linear Feet per Minute): | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 200 (1.0 m/s) | 12.58 | | 400 (2.0 m/s) | 5.85 | | 600 (3.0 m/s) | 4.37 | ---