The **ATS-13F-40-C3-R0** is a high-performance electronic component specifically designed for **thermal management**. It is a **heat sink** manufactured by Advanced Thermal Solutions (ATS) as part of their "pushPIN™" series. --- ## 1. Technical Specifications Below are the primary physical and thermal characteristics of this component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 14.71 °C/W (at 100 LFM) | | **Dimensions** | 45mm x 45mm x 25mm | | **Fin Style** | XCUT (Cross-cut) | | **Thermal Interface Material (TIM)** | T412 (High performance) | --- ## 2. Key Electronic & Physical Components ### A. The Heat Sink Body (XCUT Design) The "XCUT" geometry refers to a fin pattern that allows for multi-directional airflow. In modern electronic enclosures where fans might be placed at various angles, this design ensures the heat sink remains efficient regardless of the air intake direction. ### B. PushPIN™ Attachment System Instead of using messy adhesives or thermal tape, this part uses a mechanical attachment system: * **Brass Bolts/Pins:** Provide a secure mechanical connection to the PCB. * **Stainless Steel Springs:** Ensure constant and even pressure (compression) on the electronic chip, which is critical for maximizing heat transfer. ### C. Thermal Interface Material (T412) The bottom of the unit comes pre-applied with **T412**. This is a phase-change or high-conductivity material that fills the microscopic air gaps between the heat sink and the CPU/GPU/ASIC, significantly lowering the thermal resistance. --- ## 3. Applications in Electronics This specific heat sink is typically used for: 1. **High-Speed Networking:** Cooling for switches and routers. 2. **Processors:** Cooling for FPGAs, ASICs, and small CPUs. 3. **Power Supplies:** Managing heat in high-efficiency power conversion modules. --- ## 4. Performance Summary The part is designed to balance **weight** and **thermal dissipation**. With a height of 25mm, it is suitable for 1U or 2U rack-mounted electronic systems where vertical space is limited but cooling demands are high.