ATS-13F-49-C3-R0
AI

The **ATS-13F-49-C3-R0** is a high-performance electronic thermal management component, specifically a **Heatsink** designed by Advanced Thermal Solutions (ATS). It is part of the "pushPIN™" series, engineered for cooling integrated circuits (ICs) like CPUs, GPUs, or FPGAs.
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### 1. Technical Specifications
Below are the primary physical and thermal characteristics of the component:
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Material** | Aluminum (AL6063) |
| **Dimensions** | 25mm x 25mm |
| **Height** | 20mm |
| **Fin Style** | Blue Anodized, Fine Pitch |
| **Attachment Type** | pushPIN™ (Spring-loaded) |
| **Thermal Resistance** | ~2.70°C/W (at 200 LFM) |
| **Thermal Interface** | T412 (Phase Change Material) |
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### 2. Design and Components
The ATS-13F-49-C3-R0 consists of several key electronic/mechanical parts that work together to dissipate heat:
#### A. The Heat Sink Body
* **Aluminum 6063:** Chosen for its high thermal conductivity and lightweight properties.
* **Fin Geometry:** The "Fine Pitch" design increases the surface area exposed to the air, allowing for efficient heat transfer via convection.
#### B. The pushPIN™ Attachment System
* **Brass/Steel Springs:** These provide constant, reliable pressure between the heatsink and the electronic chip.
* **Nylon/Plastic Pins:** Used to lock the assembly into the PCB holes securely without causing electrical shorts.
#### C. Thermal Interface Material (TIM)
* **Pre-applied T412:** This is a specialized layer at the bottom of the heatsink. When the electronic part heats up, this material softens to fill microscopic air gaps between the chip and the aluminum, significantly reducing thermal resistance.
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### 3. Application Use Case
This specific part is typically found in:
1. **Networking Equipment:** Switches and routers where airflow is constant but space is limited.
2. **Embedded Systems:** Industrial PCs requiring robust mechanical attachment against vibration.
3. **Power Electronics:** Compact voltage regulators or high-speed processors.
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### 4. Part Number Breakdown
`ATS - 13 F - 49 - C3 - R0`
* **ATS:** Advanced Thermal Solutions (Manufacturer).
* **13:** Series/Designator.
* **F:** Fin pitch configuration.
* **49:** Specific dimensions/height code.
* **C3:** Material/Finish (Blue Anodized).
* **R0:** Revision/Packaging code.
- ⤷What are the specific thermal resistance values at different airflow speeds (LFM)?
- ⤷ How does the T412 thermal interface material compare to standard thermal paste?
- ⤷ What size PCB holes are required for the pushPIN attachment?