The **ATS-13F-52-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** series, designed to dissipate heat from high-power electronic components like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications The following table summarizes the key physical and thermal characteristics of this part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum (Anodized Blue) | | **Thermal Resistance** | 3.54°C/W (at 200 LFM) | | **Dimensions (L x W x H)** | 57.5mm x 57.5mm x 15mm | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Fin Style** | Tapered (maxiFLOW) | | **Thermal Interface Material (TIM)** | T412 (Pre-applied) | --- ### 2. Key Design Features #### A. maxiFLOW™ Fin Design Unlike traditional straight-fin heat sinks, this part uses a **tapered fin** geometry. This design increases the surface area for heat dissipation while minimizing pressure drop across the device, making it highly efficient in forced-air environments (fan-cooled systems). #### B. pushPIN™ Attachment The part uses a specialized "pushPIN" mechanism rather than adhesive tape. * **Mechanical Integrity:** Provides consistent pressure on the component to maximize heat transfer. * **Ease of Install:** Uses a brass or plastic pin and a compression spring for secure mounting to the PCB via pre-drilled holes. #### C. Thermal Interface Material (TIM) The heat sink comes with **T412** material pre-applied to the base. This is a high-performance thermal pad that fills microscopic air gaps between the component and the heat sink, ensuring low thermal resistance at the contact point. --- ### 3. Application Use-Cases This specific size and thermal rating are typically found in: * **Telecommunications:** Cooling of networking switches and routers. * **Computing:** Secondary cooling for chipsets or power modules. * **Industrial:** High-density power supplies and motor controllers where airflow is available. ---