The **ATS-13F-55-C3-R0** is a high-performance electronic thermal management component, specifically a **Heatsink** designed for cooling integrated circuits (ICs) and other electronic components. It is part of the "Advanced Thermal Solutions" (ATS) push-pin series. --- ### 1. Technical Specifications Below are the primary technical parameters for this specific part number: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Brass) | | **Spring Type** | Compression Spring | | **Thermal Resistance** | 23.98°C/W (Unducted Flow @ 100 LFM) | | **Dimensions (L x W x H)** | 40mm x 40mm x 10mm | | **Fin Pattern** | XCUT (Cross-Cut) | --- ### 2. Breakdown of the Part Number The part number follows a specific nomenclature used by ATS to define the physical characteristics of the unit: * **ATS**: Manufacturer (Advanced Thermal Solutions). * **13**: Series identifier (typically refers to the attachment style/material). * **F**: Fin profile or material designation. * **55**: Specific geometric configuration code. * **C3**: Thermal Interface Material (TIM) type. In this case, it usually indicates **T766** (a high-performance thermal phase change material) pre-applied to the base. * **R0**: RoHS compliance status and revision. --- ### 3. Key Electronic Cooling Features #### A. XCUT Fin Design The "XCUT" or cross-cut design features a matrix of square pins rather than long continuous fins. This provides: * **Multi-directional airflow:** It can dissipate heat effectively regardless of which direction the fan is blowing. * **Increased Surface Area:** The cross-cuts increase the total area available for convection. #### B. Push-Pin Attachment Instead of using messy adhesives or thermal tape, this part uses a mechanical push-pin system. * **Reliability:** Provides constant pressure (preload) against the chip, ensuring a consistent thermal connection. * **Ease of Assembly:** The brass push-pins snap into pre-drilled holes on the Printed Circuit Board (PCB). #### C. Thermal Interface Material (TIM) The "C3" designation indicates it comes with a pre-applied thermal pad. This eliminates the need for manual application of thermal grease, reducing assembly time and preventing air gaps between the component and the heatsink. --- ### 4. Common Applications This heatsink is typically found in: 1. **Networking Hardware:** Switches, routers, and high-speed modems. 2. **Embedded Systems:** Industrial PCs and Single Board Computers (SBCs). 3. **Power Electronics:** Voltage regulators and motor drivers.