The **ATS-13F-71-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** series, designed to provide high-efficiency cooling for high-powered electronic devices like CPUs, FPGAs, and GPUs. --- ### 1. Technical Specifications The following table highlights the critical physical and thermal properties of the component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Black Anodized) | | **Thermal Resistance** | 6.77°C/W (at 200 LFM) | | **Dimensions (L x W x H)** | 45mm x 45mm x 30mm | | **Attachment Method** | pushPIN™ | | **Internal Interface Material (TIM)** | T766 (High performance) | | **Airflow Direction** | Vertical / Omni-directional fins | --- ### 2. Key Design Elements #### A. maxiFLOW™ Geometry The "F" in the part number indicates the maxiFLOW™ fin profile. These fins are tapered and spread out to increase surface area while minimizing pressure drop. This design allows for better airflow through the heat sink compared to standard straight-fin designs. #### B. pushPIN™ Attachment System The part utilizes the **pushPIN™** system, which offers several advantages: * **Constant Pressure:** A high-tension spring ensures consistent contact between the heat sink and the electronic component for optimal heat transfer. * **Easy Installation:** Flexible hardware allows for quick mounting to a PCB with pre-drilled holes. * **Mechanical Stability:** Prevents the heat sink from shifting during vibration or shock. #### C. Thermal Interface Material (TIM) The "C3" suffix denotes that the heat sink comes pre-applied with **T766 thermal grease**. This eliminates the need for manual application and ensures there are no air gaps between the heat source and the aluminum base. --- ### 3. Application Use Cases This specific model is typically used in environments where high-density components generate significant heat in a small footprint: 1. **Telecommunications:** Networking switches and routers. 2. **Power Electronics:** Converters and high-speed motor controllers. 3. **Embedded Computing:** Industrial PC processors and high-performance SoC units.