The **ATS-13F-77-C3-R0** is a high-performance heat sink manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **pushPIN™** series and is designed specifically for cooling electronic components such as CPUs, GPUs, and other integrated circuits. ### 1. Technical Specifications Below are the primary physical and thermal characteristics of the component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Dimensions** | 25mm x 25mm x 30mm | | **Fin Style** | Straight Fin | | **Thermal Resistance** | 9.58°C/W (Unducted Flow @ 100 LFM) | | **Spring Type** | ATS-PPS-13 (Compression Spring) | --- ### 2. Electronic/Thermal Performance The efficiency of this part depends heavily on the airflow (Velocity) within the electronic enclosure. | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 9.58 | | 200 (1.0 m/s) | 3.85 | | 300 (1.5 m/s) | 2.80 | | 400 (2.0 m/s) | 2.36 | | 500 (2.5 m/s) | 2.12 | --- ### 3. Key Component Features * **Push-Pin Attachment:** This model uses a tool-free push-pin mechanism. It features a pre-drilled hole pattern that allows for quick installation onto a PCB, ensuring consistent pressure for optimal heat transfer. * **High Aspect Ratio Fins:** The "77" series uses a specific fin density designed to maximize surface area while maintaining a footprint small enough for compact electronics (25mm x 25mm). * **Thermal Interface Material (TIM):** The part typically comes with a pre-applied **T412** thermal interface material, which is a high-performance thermal pad that fills microscopic air gaps between the chip and the heat sink. * **Durability:** The Blue Anodized finish is not just for aesthetics; it provides surface protection against corrosion and increases the emissivity of the aluminum, slightly improving radiation heat transfer. --- ### 4. Typical Applications * **Networking Equipment:** High-speed routers and switches. * **Embedded Systems:** Industrial PCs and controllers. * **Power Electronics:** Voltage regulators and high-density power modules.