The **ATS-13F-82-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push-pin" series designed for cooling surface-mount components like CPUs, GPUs, and FPGAs. --- ### 1. Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-13F-82-C3-R0 | | **Product Category** | Heat Sinks | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Spring-loaded) | | **Thermal Resistance** | 10.97°C/W (@ 100 LFM) | | **Dimensions (L x W x H)** | 30mm x 30mm x 25mm | --- ### 2. Key Design Components #### A. Fin Pattern: Straight Fin This model uses a **Straight Fin** design. While cross-cut fins are better for omnidirectional airflow, straight fins are highly efficient in systems where there is a consistent, directed airflow from a specific direction. #### B. Attachment: Push-Pin and Brass Spring The "R0" designation refers to the mounting kit. It uses a plastic push-pin with a brass spring. * **Benefits:** Provides consistent pressure for optimal thermal interface material (TIM) performance. * **Security:** Offers a more secure mechanical connection than adhesive tapes, especially in high-vibration environments. #### C. Thermal Interface Material (TIM) This part typically comes pre-applied with **T412**, a high-performance phase-change material or thermal tape, ensuring an even thermal bridge between the chip and the aluminum base. --- ### 3. Thermal Performance Profile The effectiveness of this heat sink varies based on the airflow (measured in Linear Feet per Minute - LFM): | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (Natural/Low) | 10.97 | | 300 (Moderate) | 4.25 | | 500 (High) | 3.13 | --- ### 4. Applications * **Telecommunications:** Cooling of high-speed networking chips. * **Industrial PC:** Cooling processors in fan-less or restricted airflow chassis. * **Embedded Systems:** Ideal for 30mm x 30mm footprint ICs that generate moderate heat loads.