The **ATS-13F-86-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push pin" series designed for cooling surface-mount components like BGA (Ball Grid Array) chips. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of the part: | Attribute | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum (with Blue Anodized Finish) | | **Dimensions** | 35.00mm x 35.00mm | | **Height** | 15.00mm | | **Attachment Type** | Push-Pin (Brass) | | **Spring Type** | Compression Spring | | **Thermal Interface (TIM)** | T412 (Pre-applied) | --- ### 2. Design and Engineering Features ### A. Fin Geometry (Cross-Cut) The "F" in the part number often indicates a cross-cut or high-efficiency fin design. This allows for **multi-directional airflow**, meaning the heat sink remains effective regardless of whether the air is blowing vertically or horizontally across the PCB. ### B. Push-Pin Attachment Mechanism Instead of using messy thermal adhesives or tapes, this part uses a mechanical attachment system: * **Hole Pattern:** Requires pre-drilled holes in the PCB. * **Stability:** Provides consistent pressure on the component, improving thermal contact. * **Reliability:** Resistant to shock and vibration compared to "peel-and-stick" solutions. ### C. Thermal Performance The efficiency of this heat sink is measured by its thermal resistance ($^\circ C/W$). At lower airflows, the resistance is higher, while higher air velocities significantly improve cooling. --- ### 3. Part Number Breakdown The nomenclature for ATS heat sinks generally follows this logic: * **ATS**: Brand (Advanced Thermal Solutions). * **13**: Series/Style (typically referring to the fin pattern). * **F**: Material/Finish indicator or fin type. * **86**: Specific size/geometry code. * **C3**: Attachment and Spring kit code (refers to the specific push-pin and spring tension). * **R0**: Revision or RoHS compliance indicator. --- ### 4. Application Use Cases This component is typically found in: * **Networking Equipment:** Routers, switches, and gateways. * **Industrial PCs:** Cooling embedded processors or FPGAs. * **Power Electronics:** Dissipating heat from high-current voltage regulators.