The **ATS-13F-90-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **pushPIN™** series, designed for efficient heat dissipation on Printed Circuit Boards (PCBs). --- ### 1. Technical Specifications Below are the key mechanical and thermal characteristics of the component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Type** | pushPIN™ | | **Dimensions (L x W x H)** | 35.00mm x 35.00mm x 25.00mm | | **Fin Style** | Straight Fin (Fine Pitch) | | **Thermal Resistance (Unducted)** | 6.36 °C/W @ 100 LFM | | **Thermal Resistance (Ducted)** | 1.60 °C/W @ 100 LFM | --- ### 2. Breakdown of the Part Number The nomenclature for this part follows a specific pattern used by Advanced Thermal Solutions: 1. **ATS**: Manufacturer prefix (Advanced Thermal Solutions). 2. **13**: Series Number. 3. **F**: Attachment style (Push-Pin). 4. **90**: Fin Pitch/Height configuration code. 5. **C2**: Material and Thermal Interface Material (TIM) code (indicates T766 phase-change material). 6. **R0**: Revision/Packaging code. --- ### 3. Key Electronic Functions While the heat sink itself is passive (it does not contain circuits), its role is critical for the electronic health of the system: * **Thermal Dissipation**: It increases the surface area of a heat-generating component (like an FPGA, ASIC, or CPU), allowing air to carry heat away more effectively. * **Thermal Interface Material (TIM)**: The "C2" designation implies it comes pre-applied with high-performance TIM, which fills microscopic air gaps between the component and the heat sink to ensure maximum heat transfer. * **Mechanical Stability**: The pushPIN™ system uses a compression spring and plastic/brass pins to ensure constant, even pressure on the chip, preventing "tilting" which could crack the silicon die or break solder joints (BGA pads). --- ### 4. Implementation Example In a typical PCB design, this part is mounted over a 35mm square chip. The attachment requires two holes drilled into the PCB at a specific distance (Pitch). ```markdown # PCB Footprint Note - Hole Diameter: 3.175mm (typical for pushPIN) - Hole Pitch: 28.50mm (center-to-center) - Keep-out Zone: 40.00mm square to allow for spring compression ``` ---