The **ATS-13F-91-C3-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) Heat Sink**. It belongs to the **maxiFLOW™** series, designed to dissipate heat from electronic components like CPUs, GPUs, or FPGAs in high-airflow environments. --- ### Technical Specifications | Feature | Specification | | :--- | :--- | | **Part Number** | ATS-13F-91-C3-R0 | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Material** | Aluminum (Body) / Blue Anodized (Finish) | | **Thermal Resistance** | ~4.90 °C/W (at 200 LFM) | | **Dimensions (L x W x H)** | 40mm x 40mm x 10mm | | **Flow Direction** | Unidirectional / High-Efficiency | --- ### Component Breakdown #### 1. Heat Sink Design (maxiFLOW™) The "91" in the part number refers to the specific fin geometry. The **maxiFLOW™** design features a tapered fin structure that increases the surface area while reducing pressure drop. This allows more air to pass through the fins, making it ideal for systems with concentrated airflow. #### 2. Attachment System (pushPIN™) Unlike simple adhesive tapes, this part uses the **pushPIN™** system: * **Spring-loaded mechanism:** Ensures constant and even pressure on the chip. * **Brass/Plastic Pins:** Provides a secure mechanical attachment to the PCB. * **Reliability:** Resistant to vibration and thermal expansion, preventing the heat sink from detaching over time. #### 3. Thermal Interface Material (TIM) The **C3** designation in the part number indicates the type of pre-applied Thermal Interface Material: * **Type:** T766 (or equivalent high-performance phase-change material). * **Function:** It fills microscopic air gaps between the component surface and the heat sink base to maximize heat transfer. #### 4. Material and Finish * **Aluminum:** Chosen for its excellent thermal conductivity-to-weight ratio. * **Blue Anodized Finish:** Not just for aesthetics; the anodization protects the aluminum from corrosion and slightly increases emissivity for better heat radiation. --- ### Applications * **Embedded Computing:** Cooling high-speed processors in industrial PCs. * **Networking:** Used on ASICs in routers and switches. * **Power Electronics:** Managing heat in DC-DC converters.