## Technical Overview: ATS-13F-99-C2-R0 The **ATS-13F-99-C2-R0** is a high-performance **Heat Sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "pushPIN™" series, designed for cooling electronic components like CPUs, GPUs, and other integrated circuits. ### 1. Key Specifications Below are the primary physical and thermal characteristics of the component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Blue Anodized) | | **Attachment Type** | pushPIN™ (Spring-loaded) | | **Fin Type** | Fine-Pitch (increases surface area) | | **Dimensions** | 45mm x 45mm x 20mm | | **Thermal Resistance** | 11.52 °C/W (at 100 LFM) | | **TIM (Thermal Interface Material)** | T766 (Pre-applied) | --- ### 2. Functional Components 1. **Heat Sink Body**: Constructed from extruded aluminum for efficient heat conduction. The 20mm height offers a balance between airflow clearance and surface area. 2. **Fine-Pitch Fin Design**: The "99" in the part number refers to the specific fin pattern. Fine-pitch fins are optimized for systems with consistent airflow (forced convection), allowing for maximum heat dissipation in a compact footprint. 3. **pushPIN™ Attachment**: This mechanism uses a brass or plastic pin with a stainless steel spring. It provides: * **Consistent Pressure**: Ensures optimal contact between the heat sink and the chip. * **Secure Fit**: Prevents the sink from shifting during vibration or shipping. 4. **Thermal Interface Material (TIM)**: Comes pre-applied with **T766** phase-change material, which fills microscopic air gaps between the component and the heat sink to improve thermal conductivity. --- ### 3. Applications This part is typically used in environments where vertical space is somewhat restricted but thermal loads are significant, such as: * **Networking Equipment**: Switches and routers. * **Embedded Systems**: Industrial PCs and IoT gateways. * **Power Electronics**: Cooling voltage regulators or power modules.