Electronic Components Datasheet Search
  English  ▼
ALLDATASHEET.NET

X  

  • ATS-13G-101-C3-R0

  • AI
    The **ATS-13G-101-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **maxiFLOW™** series, designed to provide high-efficiency cooling for electronic components like BGAs (Ball Grid Arrays). --- ### 1. Technical Specifications The part is defined by its material composition, dimensions, and thermal performance characteristics. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | maxiFLOW™ | | **Thermal Resistance** | 0.82° C/W @ 200 LFM | | **Material** | Aluminum (with Blue Anodized finish) | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (LxWxH)** | 40mm x 40mm x 30mm | | **Airflow Direction** | Cross-cut (Multiple directions) | --- ### 2. Key Electronic Features #### A. Thermal Interface Material (TIM) This specific model usually comes pre-applied with **T766 phase change material**. This acts as a bridge between the electronic component (CPU, GPU, or FPGA) and the heat sink, filling microscopic air gaps to maximize heat transfer efficiency. #### B. pushPIN™ Attachment System Rather than using adhesive tapes that can fail under high heat, this part uses a mechanical **pushPIN™** system. This ensures: * Consistent pressure across the electronic chip. * Reliable vibration resistance for industrial or automotive electronics. * Easy installation and removal for maintenance. #### C. Fin Design (maxiFLOW™) The "spread fin" geometry is engineered to maximize surface area while minimizing pressure drop. In high-density electronic enclosures, this allows the heat sink to dissipate heat effectively even with low-velocity airflow. --- ### 3. Common Applications This part is typically used to cool sensitive integrated circuits in the following fields: * **Networking:** High-speed routers and switches. * **Telecommunications:** Base station power modules. * **Computing:** High-end servers and embedded processing units. * **Industrial:** Power supplies and motor controllers. --- ### 4. Part Number Breakdown Understanding the nomenclature helps in identifying variants: * **ATS:** Manufacturer prefix. * **13G:** Refers to the specific series/fin geometry. * **101:** Dimensional code. * **C3:** Finish/Material code (usually indicating Blue Anodized). * **R0:** Revision code.
    ✨ Follow-up Questions
    • ⤷ What is the difference between pushPIN and adhesive mounting for this heat sink?
    • ⤷ How does the T766 phase change material compare to standard thermal grease?
    • ⤷ Is there a CAD file or 3D model available for integration into a PCB design?