The **ATS-13G-41-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "pushPIN™" family, designed for cooling electronic components such as CPUs, GPUs, and high-heat ICs. ### 1. Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-13G-41-C2-R0 | | **Base Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance** | 10.02°C/W (at 100 LFM airflow) | | **Dimensions (L x W x H)** | 40mm x 40mm x 30mm | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Interface Material** | T766 (Thermal Interface Material pre-applied) | --- ### 2. Physical Design and Construction #### Fin Configuration The "G" in the part number indicates a **straight fin** or **cross-cut** design. This allows for optimal airflow in one or multiple directions, depending on the orientation of the chassis fans. #### Material and Coating * **Aluminum:** Chosen for its excellent thermal conductivity-to-weight ratio. * **Blue Anodized Finish:** This provides more than just aesthetic value; the anodization process increases surface emissivity, slightly improving radiation heat transfer and protecting the aluminum from corrosion. --- ### 3. Attachment Mechanism: pushPIN™ The suffix **R0** indicates the specific hardware used for mounting. This part utilizes a spring-loaded pin mechanism which offers several advantages: 1. **Uniform Pressure:** Ensures consistent contact between the heat sink base and the electronic component, maximizing heat transfer. 2. **Vibration Resistance:** The spring tension keeps the heat sink secure in high-vibration environments (like industrial machinery or servers). 3. **Easy Installation:** Requires pre-drilled holes in the PCB, allowing for quick assembly without specialized tools. --- ### 4. Thermal Performance The efficiency of this part is measured by its thermal resistance. As airflow increases, the resistance drops, allowing for more heat dissipation: | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 10.02 | | 300 (1.5 m/s) | 3.11 | | 500 (2.5 m/s) | 2.11 | --- ### 5. Part Number Breakdown (Example) * **ATS:** Advanced Thermal Solutions (Manufacturer) * **13:** Series/Family * **G:** Fin design/Style * **41:** Dimensions (Size category) * **C2:** Blue Anodized / Thermal Performance grade * **R0:** Attachment hardware and revision status