The **ATS-13G-71-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic integrated circuits (ICs) and surface-mount devices (SMDs). --- ### 1. Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Product Type** | Push-Pin Heat Sink | | **Dimensions (L x W x H)** | 45mm x 45mm x 30mm | | **Thermal Resistance** | 6.70°C/W (Unducted Flow @ 200 LFM) | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | Push-Pin (Brass/Plastic) | | **Thermal Interface Material (TIM)** | T766 (High performance) | --- ### 2. Key Components & Design Features #### A. Fin Pattern (Cross-Cut) The unit features a **straight-fin, cross-cut** design. This creates a matrix of pins/fins that allows for multi-directional airflow. This is particularly effective in systems where the direction of the cooling fan's exhaust might not be perfectly aligned with the heat sink. #### B. Push-Pin Attachment Mechanism Instead of using adhesive tape or epoxy, this model uses a mechanical push-pin system. * **Reliability:** Provides constant pressure for better thermal contact. * **Safety:** Prevents the heat sink from shifting or falling off due to vibration or high temperatures. * **Installation:** Requires pre-drilled holes in the PCB. #### C. Thermal Interface Material (TIM) The "C2" in the part number indicates it comes pre-applied with **ATS-T766**. This is a high-performance thermal grease or pad that fills microscopic air gaps between the chip surface and the heat sink base, significantly reducing thermal resistance. --- ### 3. Part Number Breakdown Understanding the nomenclature helps in identifying variants: | Segment | Meaning | | :--- | :--- | | **ATS** | Advanced Thermal Solutions (Brand) | | **13G** | Series Identifier (Push-pin style) | | **71** | Specific Dimension/Fin Configuration | | **C2** | Thermal Interface Material (T766) | | **R0** | RoHS Compliant / Revision code | --- ### 4. Typical Applications * **Network Switches/Routers:** Cooling high-speed processors. * **Industrial PCs:** Ensuring stability in harsh thermal environments. * **Power Supplies:** Dissipating heat from MOSFETs or Power ICs. * **FPGA/ASIC Cooling:** Protecting high-value logic chips from thermal throttling.