The **ATS-13G-79-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push pin" series designed for securing heat sinks directly to Printed Circuit Boards (PCBs). --- ## Technical Specifications The following table outlines the physical and thermal characteristics of this specific part: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Base Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 30.00mm x 30.00mm x 20.00mm | | **Attachment Method** | Push-Pin (Spring Loaded) | | **Thermal Resistance (Unducted)** | 2.63 °C/W @ 100 LFM | | **Thermal Resistance (Ducted)** | 1.17 °C/W @ 100 LFM | | **Fin Configuration** | Fine Pitch (Cross-Cut) | --- ## Component Breakdown ### 1. The Heat Sink Body The main body is constructed from aluminum for high thermal conductivity. It features a **cross-cut fin design**. This design allows for airflow from multiple directions, making it more efficient in systems where air direction might be turbulent or non-linear. ### 2. Attachment Mechanism (Push-Pin) Instead of using thermal adhesive (which can fail over time) or screws (which can damage boards), this part uses a **Push-Pin and Brass Spring** system: * **Reliability:** Provides consistent pressure on the component (CPU/GPU/FPGA) to ensure maximum heat transfer. * **Ease of Installation:** Snaps into pre-drilled holes in the PCB. ### 3. Thermal Interface Material (TIM) The "R0" suffix indicates that the part typically comes with **pre-applied thermal interface material**. This is a high-performance phase-change material or thermal grease that fills microscopic air gaps between the heat sink and the chip. --- ## Typical Applications This specific heat sink is often found on high-heat electronic components such as: * **BGA (Ball Grid Array) Chips** * **FPGAs and ASICs** * **Network Switches and Routers** * **Embedded Computing Modules** ---