The **ATS-13G-85-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push pin" series designed for cooling surface-mount components like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of the part: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Brass) | | **Thermal Resistance** | 22.98°C/W (Unducted Flow @ 200 LFM) | | **Dimensions (L x W x H)** | 30.00mm x 30.00mm x 10.00mm | | **Fin Style** | Fine Pitch (Straight Fin) | | **Interface Material** | T766 (Thermal Tape/Phase Change) | --- ### 2. Detailed Component Breakdown #### A. The Heat Sink Body The body is constructed from **Aluminum 6063**, which offers a balance of high thermal conductivity and structural integrity. The **Blue Anodized** coating is not just aesthetic; it provides corrosion resistance and increases surface emissivity, slightly improving radiant heat transfer. #### B. Push-Pin Mounting Mechanism Unlike adhesive-only heat sinks, the "R0" suffix indicates a mechanical mounting system: * **Spring-Loaded Push Pins:** These ensure a consistent, pre-determined pressure (clamping force) on the electronic component. * **Brass Pins:** Provides durability and high retention force, preventing the heat sink from shifting during vibration or shipping. #### C. Thermal Interface Material (TIM) The part comes pre-applied with **T766**. This is a high-performance thermal pad or phase-change material that fills microscopic air gaps between the heat sink base and the chip surface to maximize heat conduction. --- ### 3. Part Number Decoder Understanding the nomenclature helps in identifying specific features: | Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer: Advanced Thermal Solutions | | **13G** | Series Identifier (Push-Pin type) | | **85** | Specific geometry/fin configuration | | **C2** | Color/Finish (Blue Anodized) | | **R0** | Revision or Packaging code | --- ### 4. Applications This specific size (30mm x 30mm) is commonly used for: * **Network Switches:** Cooling ASICs and processors. * **Embedded Systems:** Industrial PCs where mechanical stability is required. * **Power Supplies:** Dissipating heat from high-speed voltage regulators.