The **ATS-13H-101-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic integrated circuits (ICs) like CPUs, GPUs, or power transistors. ### 1. Technical Specifications The following table highlights the core physical and thermal properties of this specific part: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions** | 45mm x 45mm x 30mm | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 6.69°C/W (at 100 LFM) | | **Airflow Pattern** | Straight Fin | --- ### 2. Key Components & Design * **pushPIN™ Attachment:** This model uses a spring-loaded mechanism (pushPIN) that provides a secure, consistent pressure on the electronic component. This ensures optimal thermal interface material (TIM) performance. * **High Aspect Ratio Fins:** The "straight fin" design is optimized for high-density airflow environments. The 30mm height allows for a significant surface area to volume ratio. * **Blue Anodized Coating:** Beyond aesthetics, the anodization protects the aluminum from corrosion and slightly improves radiant heat transfer. * **Pre-Applied Thermal Interface Material (TIM):** Most "C2" series parts come with **T766** phase-change material or similar, which eliminates the need for manual application of thermal paste. --- ### 3. Thermal Performance Metrics The effectiveness of this heat sink depends heavily on the velocity of the air passing through it (measured in Linear Feet per Minute - LFM): | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 6.69 | | 300 (1.5 m/s) | 2.52 | | 500 (2.5 m/s) | 1.74 | --- ### 4. Application Use Cases 1. **Telecommunications:** Cooling of networking processors in routers or switches. 2. **Industrial Controls:** Managing heat in motor drivers or power supplies. 3. **Embedded Systems:** Use in high-performance computing modules where vertical space (30mm) is available. ---