The **ATS-13H-35-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **pushPIN™** series, designed for efficient cooling of integrated circuits (ICs) like processors, FPGAs, and ASICs. --- ## 🛠️ Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Type** | Push-Pin (Plastic) | | **Thermal Resistance** | 12.83°C/W (Unducted @ 100 LFM) | | **Dimensions (L x W x H)** | 35mm x 35mm x 10mm | | **Fin Configuration** | Fine Pitch (Cross-Cut) | --- ## 🔍 Key Electronic & Mechanical Components ### 1. The Heat Sink Body The body is made of **Aluminum 6063**, which is preferred in electronics for its high thermal conductivity and lightweight properties. The "Fine Pitch" design increases the surface area, allowing for better heat dissipation into the surrounding air. ### 2. Push-Pin Attachment Mechanism Instead of using messy thermal adhesives or complex screws, this part uses a **spring-loaded push-pin system**. * **Pins:** Usually made of durable plastic or brass. * **Springs:** Provide a consistent **compression force** to ensure the heat sink remains in tight contact with the electronic component, which is vital for thermal transfer. ### 3. Thermal Interface Material (TIM) The "R0" suffix typically indicates that the unit comes with **pre-applied thermal interface material**. This is a layer of specialized paste or a pad that fills microscopic air gaps between the heat sink and the chip, significantly reducing thermal resistance. --- ## 📈 Performance Characteristics The efficiency of this part depends heavily on the airflow (measured in Linear Feet per Minute - LFM). ### Thermal Resistance Table | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 12.83 | | 300 (1.5 m/s) | 4.32 | | 500 (2.5 m/s) | 3.07 | --- ## 💡 Typical Applications * **Embedded Systems:** Cooling small form-factor CPUs. * **Telecommunications:** Dissipating heat from high-speed networking chips. * **Industrial PC:** Ensuring stability in harsh environments where vibration might loosen standard adhesives.