The **ATS-13H-41-C2-R0** is a high-performance electronic thermal management component, specifically a **Heatsink** designed for cooling integrated circuits (ICs) and other electronic components. Below is a detailed breakdown of its electronic and physical specifications. --- ### 1. General Specifications | Feature | Description | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Series** | pushPIN™ | | **Part Number** | ATS-13H-41-C2-R0 | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin | --- ### 2. Physical Dimensions Precision sizing is critical for ensuring the heatsink fits within the PCB constraints without interfering with neighboring components. * **Length:** 45.00 mm * **Width:** 45.00 mm * **Height (Fin Depth):** 17.50 mm * **Pitch (Hole Spacing):** 38.00 mm --- ### 3. Thermal Performance Thermal resistance determines how effectively the part moves heat away from the silicon die. Lower values indicate better cooling efficiency. | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | **100 (Unducted)** | 10.07 | | **200 (Unducted)** | 3.20 | | **300 (Unducted)** | 1.90 | | **400 (Unducted)** | 1.39 | --- ### 4. Key Electronic Components & Features * **Push-Pin Mounting:** Uses a spring-loaded push-pin mechanism. This provides consistent pressure (load) on the high-power component, which optimizes thermal interface material (TIM) performance. * **Square Fin Design:** The "cross-cut" or square fin pattern allows for multi-directional airflow, making it suitable for systems where air direction might change or be obstructed. * **C2 Material Grade:** The "C2" suffix typically indicates that the product uses a specific thermal interface material (like a pre-applied thermal tape or grease) or refers to the Blue Anodized finish used for corrosion resistance and improved emissivity. * **R0 Rating:** This signifies that the part is **RoHS (Restriction of Hazardous Substances) compliant**, ensuring it meets environmental safety standards for lead and other toxic materials. ### 5. Application Use Cases This heatsink is commonly found in: 1. **Network Switches/Routers:** Cooling high-speed processing chips. 2. **Power Supplies:** Dissipating heat from MOSFETs or voltage regulators. 3. **Embedded Systems:** Industrial PCs where active fan cooling may be limited. ---