The **ATS-13H-72-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). ### 1. Technical Specifications The table below outlines the core physical and thermal characteristics of this specific part: | Characteristic | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Series** | pushPIN™ | | **Attachment Type** | Push-Pin (Spring Loaded) | | **Material** | Aluminum (Blue Anodized) | | **Fin Type** | Straight Fin | | **Dimensions (L x W)** | 45mm x 45mm | | **Height (Off Base)** | 35mm | | **Hole Pattern** | 38mm x 38mm | | **Thermal Resistance** | 5.11°C/W (Unducted Flow @ 100 LFM) | --- ### 2. Key Components & Design Features #### A. Attachment Mechanism (Push-Pin) This part utilizes a **Push-Pin** mounting system. * **Springs:** Uses brass or plastic pins with stainless steel springs to provide consistent pressure. * **Securement:** Requires pre-drilled holes in the PCB (Printed Circuit Board) to lock the heat sink in place over the component (typically a BGA or CPU). #### B. Thermal Interface Material (TIM) The "C2" suffix indicates that this model comes pre-applied with **T766 Phase Change Material**. * **Function:** Fills microscopic air gaps between the heat sink base and the electronic chip to maximize heat transfer. * **Advantage:** Eliminates the need for manual thermal paste application during assembly. #### C. Material and Coating * **Aluminum 6063:** Provides a balance between thermal conductivity and lightweight properties. * **Blue Anodized Finish:** Increases surface emissivity and provides corrosion resistance. --- ### 3. Application Use Cases This specific heat sink is designed for medium-to-large surface area electronic components that generate significant heat: 1. **Processors:** CPUs, GPUs, and high-speed FPGAs. 2. **Network Hardware:** High-speed routers and switches. 3. **Power Supplies:** Cooling MOSFETs or power modules in industrial power bricks. --- ### 4. Thermal Performance Data Performance varies based on the airflow (measured in Linear Feet per Minute - LFM): | Airflow Velocity | 100 LFM (0.5m/s) | 300 LFM (1.5m/s) | 500 LFM (2.5m/s) | | :--- | :--- | :--- | :--- | | **Thermal Resistance** | 5.11 °C/W | 1.78 °C/W | 1.15 °C/W |