The **ATS-13H-75-C3-R0** is a high-performance electronic thermal management component, specifically a **Heatsink** designed by Advanced Thermal Solutions (ATS). It belongs to the **maxiFLOW™** series, known for its high-aspect-ratio fin design which maximizes surface area for cooling. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of the component: | Feature | Specification | | :--- | :--- | | **Part Number** | ATS-13H-75-C3-R0 | | **Material** | Aluminum (Black Anodized) | | **Attachment Method** | pushPIN™ | | **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 10.00mm | | **Fin Style** | Straight | | **Fin Pitch** | Coarse / Medium | | **Thermal Resistance** | 12.58 °C/W (@ 100 LFM) | | **Thermal Interface Material (TIM)** | T412 | --- ### 2. Breakdown of the Part Number The alphanumeric code follows a specific nomenclature used by Advanced Thermal Solutions: * **ATS:** Manufacturer (Advanced Thermal Solutions). * **13H:** Refers to the specific series and mounting hole configuration. * **75:** Denotes the specific length/width dimensions (in this case, 45mm x 45mm). * **C3:** Refers to the height (10mm) and fin density. * **R0:** Indicates the Revision number and finish (Black Anodized). --- ### 3. Key Electronic Cooling Features #### **pushPIN™ Attachment System** This part utilizes a specific "pushPIN" mechanism. It involves a flexible spring-loaded pin that passes through pre-drilled holes in the Printed Circuit Board (PCB), ensuring: * **Constant Pressure:** Optimizes contact between the heatsink and the component (CPU/GPU/FPGA). * **Easy Installation:** Fast assembly without needing specialized tools. * **Stability:** High resistance to vibration and shock. #### **Thermal Interface Material (TIM)** The **T412** coating is pre-applied to the base. T412 is a high-performance, gold-colored thermal tape that provides excellent mechanical adhesion and thermal conductivity, eliminating the need for separate thermal grease. #### **Airflow Performance** The straight-fin design is optimized for **forced convection** (using fans). The thermal resistance drops significantly as airflow increases: * **@ 100 LFM:** 12.58 °C/W * **@ 400 LFM:** 4.42 °C/W * **@ 700 LFM:** 3.48 °C/W --- ### 4. Typical Applications This heatsink is commonly used to cool high-heat-generating surface-mount devices (SMDs) such as: 1. **Microprocessors / CPUs** in industrial PCs. 2. **FPGAs and ASICs** in telecommunications equipment. 3. **Power Converters** in automotive electronics. 4. **Graphics Processors** in embedded vision systems.