The **ATS-13H-82-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of the part: | Characteristic | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Material** | Aluminum (with Blue Anodized Finish) | | **Dimensions** | 30mm x 30mm | | **Height** | 25mm | | **Thermal Resistance** | 2.43°C/W @ 200 LFM | | **Attachment Method** | pushPIN™ | | **Fins / Pattern** | Square-Cut (Cross-cut) | --- ### 2. Key Features and Components #### A. pushPIN™ Attachment System One of the most critical "parts" of this assembly is the **pushPIN™** system. Unlike adhesive tapes, this uses a spring-loaded mechanism to ensure: * **Constant Pressure:** Provides uniform contact between the heat sink and the component for better thermal transfer. * **Secure Mounting:** Uses pre-drilled holes in the PCB to ensure the sink doesn't shift during vibration. #### B. Blue Anodized Finish The surface is treated with a blue anodized coating. This is not just for aesthetics; it provides: * **Corrosion Resistance:** Protects the aluminum from environmental degradation. * **Electrical Insulation:** Adds a thin non-conductive layer to the surface. * **Increased Emissivity:** Improves heat radiation into the surrounding air. #### C. Cross-Cut Fin Design The "fins" (the vertical protrusions) are cut in a square pattern. This design allows for: * **Omnidirectional Airflow:** Heat can be dissipated effectively regardless of which direction the fan or air is moving across the board. * **Increased Surface Area:** Maximizes the area in contact with the air to accelerate cooling. --- ### 3. Applications This part is typically found in: * **Telecommunications:** Cooling for high-speed routers and switches. * **Industrial PCs:** Compact systems requiring high-reliability thermal management. * **Embedded Systems:** Protecting small form-factor processors from thermal throttling. ---