The **ATS-13H-85-C2-R0** is a high-performance electronic thermal management component, specifically a **Heatsink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic integrated circuits (ICs) to ensure system stability. --- ### 1. Technical Specifications The following table breaks down the core physical and thermal properties of the part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Base Series** | pushPIN™ | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Spring Type** | ATS-HK176-R0 | | **Thermal Interface (TIM)** | T766 (Pre-applied) | --- ### 2. Physical Dimensions Precise sizing is critical for PCB layout and ensuring the heatsink does not interfere with neighboring components. * **Width/Length:** 35.00mm x 35.00mm * **Height:** 10.00mm (Low profile) * **Pitch (Hole spacing):** 40.00mm * **Weight:** Approximately 17-20 grams --- ### 3. Thermal Performance Characteristics Performance is measured by thermal resistance (°C/W). Lower values indicate better cooling efficiency. | Airflow Velocity (LFM) | Thermal Resistance (Unducted) | | :--- | :--- | | **100 LFM (0.5 m/s)** | 23.98 °C/W | | **300 LFM (1.5 m/s)** | 10.25 °C/W | | **500 LFM (2.5 m/s)** | 7.70 °C/W | | **700 LFM (3.5 m/s)** | 6.52 °C/W | --- ### 4. Key Component Features 1. **Fine Pitch Design:** The "85" in the part number refers to a specific fin pattern designed for high-density airflow environments. 2. **pushPIN™ Attachment:** This system uses a flexible, spring-loaded mechanism that ensures consistent pressure between the heatsink and the chip, improving heat transfer. 3. **Pre-applied TIM:** The T766 thermal interface material ensures a high-quality thermal bond without requiring the user to manually apply thermal paste. 4. **Low Profile:** At only 10mm high, it is suitable for 1U servers or compact embedded systems where vertical space is limited. ---