The **ATS-14B-01-C2-R0** is a specific part number for a high-performance **Heat Sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "push-pin" series designed for cooling electronic components like CPUs, GPUs, and FPGAs. --- ### 1. Technical Specifications The following table outlines the mechanical and thermal characteristics of this part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Thermal Resistance** | 21.90 °C/W (Unducted Flow @ 100 LFM) | | **Dimensions (L x W x H)** | 40.00mm x 40.00mm x 10.00mm | | **TIM (Thermal Interface Material)** | T766 (Pre-applied) | --- ### 2. Component Breakdown #### A. The Heat Sink Body The device uses a **straight-fin** design. This is optimized for systems with a clear direction of airflow. The 10mm height makes it a "low-profile" solution, ideal for 1U servers or compact embedded systems where vertical space is limited. #### B. Attachment Mechanism (Push-Pins) The "B" in the part number often refers to the specific hardware configuration. This model uses a **push-pin and spring** assembly. - **Benefits:** Provides consistent pressure (clamping force) on the high-heat component, improving heat transfer. - **Requirements:** The PCB must have pre-drilled holes to accommodate the pins. #### C. Thermal Interface Material (TIM) The unit comes with **T766** pre-applied to the base. This eliminates the need for manual application of thermal paste, ensuring a uniform layer between the component and the aluminum base to minimize air gaps. --- ### 3. Part Number Decoder Understanding the "ATS-14B-01-C2-R0" nomenclature: * **ATS:** Manufacturer (Advanced Thermal Solutions). * **14:** Series/Family type. * **B:** Attachment style (Push-pin). * **01:** Dimensional code (40x40mm). * **C2:** Material/Color (Aluminum, Blue Anodized). * **R0:** Revision code. --- ### 4. Typical Applications * **Network Switches/Routers:** Cooling ASICs. * **Industrial PCs:** Heat dissipation for low-wattage processors. * **Power Supplies:** Cooling MOSFETs or voltage regulators.