The **ATS-14B-142-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ### Technical Specifications Below are the primary technical characteristics of this specific model: | Attribute | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (with springs) | | **Thermal Resistance** | 4.72°C/W (at 100 LFM) | | **Dimensions (L x W x H)** | 30.00mm x 30.00mm x 15.00mm | --- ### Key Electronic & Design Features #### 1. Fin Profile: Square-Fin The "142" in the part number identifies the specific fin geometry. Square-fin designs provide a high surface area while allowing multi-directional airflow, making it versatile for different system layouts where the fan direction might not be fixed. #### 2. Material: Aluminum (Blue Anodized) * **Thermal Conductivity:** Aluminum is used for its excellent balance between thermal conductivity and weight. * **Anodization:** The blue coating isn't just aesthetic; it protects the aluminum from corrosion and slightly improves heat radiation through emissivity. #### 3. Attachment: pushPIN™ System This model utilizes a mechanical push-pin system rather than thermal adhesive. This provides several advantages for electronics: * **Constant Pressure:** The integrated springs ensure consistent contact pressure between the heat sink and the chip, optimizing the thermal interface material (TIM) performance. * **Reliability:** Mechanical pins are more secure than tape in high-vibration environments. #### 4. Thermal Performance The efficiency of this part is measured by its **Thermal Resistance**. Lower values are better. At a standard airflow of 100 LFM (Linear Feet per Minute), it has a resistance of **4.72°C/W**, meaning for every watt of power the chip consumes, the temperature rises by 4.72 degrees Celsius above the ambient air. --- ### Ideal Applications * **Embedded Systems:** Small form factor boards (Mini-ITX, PC/104). * **Telecommunications:** Network switches and routers. * **Power Electronics:** Voltage regulators and high-speed motor controllers.