The **ATS-14B-152-C2-R0** is a high-performance thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). ### 1. Technical Specifications The following table details the mechanical and thermal characteristics of this specific part number: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | Push-pin (Brass) | | **Thermal Resistance** | 3.30°C/W (at 100 LFM) | | **Dimensions (L x W x H)** | 35.0mm x 35.0mm x 25.0mm | | **Fin Style** | Blue Anodized Straight Fin | --- ### 2. Breakdown of the Part Number The part number follows a specific nomenclature used by ATS to identify the component's features: * **ATS**: Manufacturer (Advanced Thermal Solutions). * **14B**: Refers to the specific series and mounting hole pattern. * **152**: Sequential part identifier for the size (35x35x25mm). * **C2**: Material/Finish code (Aluminum with Blue Anodize). * **R0**: Revision or packaging indicator. --- ### 3. Key Electronic/Physical Features #### A. Attachment System (pushPIN™) Unlike adhesive-based heat sinks, the "B" series uses a push-pin mechanism. * **Spring-loaded:** Ensures a constant and uniform pressure on the electronic component (CPU, GPU, or MOSFET). * **Stability:** Provides better vibration resistance compared to thermal tape. #### B. Thermal Performance The efficiency of this heat sink is measured by its thermal resistance. At lower airflow (100 Linear Feet per Minute), it dissipates heat at a rate of **3.30°C/W**. As airflow increases (e.g., to 700 LFM), the resistance drops to approximately **1.30°C/W**, making it highly effective for forced-convection environments. #### C. Material Selection * **AL6063:** This aluminum alloy is chosen for its excellent thermal conductivity and structural integrity. * **Blue Anodized Coating:** This is not just aesthetic; it increases the surface emissivity, slightly improving heat radiation and providing corrosion resistance. --- ### 4. Typical Applications This part is commonly found in: 1. **Telecommunications:** High-speed routers and switches. 2. **Embedded Systems:** Industrial PC processors. 3. **Power Electronics:** Cooling for VRMs (Voltage Regulator Modules) and power transistors.