The **ATS-14B-182-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the **maxiFLOW™** series, designed specifically for cooling electronic components like CPUs, GPUs, and high-power chipsets. --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of the component: | Feature | Specification | | :--- | :--- | | **Part Number** | ATS-14B-182-C2-R0 | | **Material** | Aluminum (Al) | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 30mm x 30mm x 15mm | | **Thermal Resistance** | 7.51°C/W (at 200 LFM) | | **Mounting Style** | pushPIN™ | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Design Characteristics This component is engineered for efficient heat dissipation in constrained spaces: * **maxiFLOW™ Fin Pattern:** The fins are designed with a tapered base and a wide top to increase surface area while minimizing pressure drop across the heat sink. * **pushPIN™ Attachment:** It features a specialized mechanical mounting system. This ensures consistent pressure between the heat sink and the chip, which is critical for thermal transfer. * **Blue Anodized Coating:** This is not just aesthetic; the anodization protects the aluminum from corrosion and slightly improves radiant heat emission. * **Thermal Interface Material (TIM):** The part comes with **T766** pre-applied. This is a high-performance phase-change material that fills microscopic air gaps between the heat sink and the electronic component. --- ### 3. Electronic Application The ATS-14B-182-C2-R0 is typically used in the following scenarios: 1. **Telecommunications:** Cooling ASICs in networking switches and routers. 2. **Embedded Systems:** High-heat dissipation in industrial computers. 3. **Power Electronics:** Cooling MOSFETs or power modules that require high thermal reliability. 4. **Airflow Optimization:** Because of its fin design, it is best suited for systems with **forced air cooling** (fans) rather than passive environments. ---