The **ATS-14B-22-C2-R0** is a specific part number for a high-performance **Heatsink** manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to their *maxiFLOW™* line, which is designed for cooling electronic components like CPUs, GPUs, and other high-heat integrated circuits. --- ### 1. Technical Specifications The part number defines the physical and thermal characteristics of the cooling solution. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | maxiFLOW™ | | **Material** | Aluminum (Black Anodized) | | **Attachment Method** | pushPIN™ | | **Dimensions (L x W x H)** | 58.42mm x 39.62mm x 22.86mm | | **Thermal Resistance** | 1.97°C/W (at 200 LFM) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Electronic Component Breakdown While the ATS-14B-22-C2-R0 is a mechanical part, it is critical to the operation of electronic systems. Here are its primary functions: #### A. Thermal Management The primary role is to dissipate heat generated by a semiconductor device. It uses a **fluted fin design** that increases surface area and promotes better airflow compared to traditional straight-fin heatsinks. #### B. The pushPIN™ Attachment System This part uses a specific mounting mechanism: * **Plastic Push Pins:** These snap into holes on the Printed Circuit Board (PCB). * **Compression Springs:** These ensure constant, uniform pressure is applied to the chip, preventing "thermal gap" issues and protecting the die from damage. #### C. Thermal Interface Material (TIM) The "C2" in the part number indicates the type of thermal grease/pad applied. The **T766** material is a high-performance compound that fills microscopic air gaps between the chip and the heatsink base, ensuring maximum heat transfer efficiency. --- ### 3. Decoding the Part Number The part number follows a specific nomenclature used by Advanced Thermal Solutions: | Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer prefix | | **14** | Package type / series identifier | | **B** | Material / Design variation | | **22** | Specific height code | | **C2** | Thermal Interface Material (T766) | | **R0** | RoHS compliance and revision status | --- ### 4. Typical Applications * **Embedded Systems:** Industrial PCs and routers. * **Power Electronics:** Cooling MOSFETs or Voltage Regulators (VRMs). * **Telecom:** Network switches and base station components where high airflow is present.