ATS-14B-29-C2-R0
AI

The **ATS-14B-29-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** series, designed to dissipate heat from high-power electronic components like CPUs, GPUs, or FPGAs.
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### 1. Technical Specifications
The part number follows a specific nomenclature used by ATS. Here are the core technical details:
| Attribute | Specification |
| :--- | :--- |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | pushPIN™ |
| **Dimensions** | 45mm x 45mm x 20mm |
| **Thermal Resistance** | 7.57°C/W (Unducted Flow @ 200 LFM) |
| **Flow Pattern** | maxiFLOW (High Performance) |
| **RoHS Status** | Compliant |
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### 2. Key Electronic Features
#### A. The maxiFLOW™ Design
The "maxiFLOW" geometry features a flared fin structure. This design increases the surface area for heat dissipation while maintaining a low pressure drop. In electronics, this allows for more efficient cooling in systems where airflow is restricted or provided by small fans.
#### B. pushPIN™ Attachment System
The part utilizes the **pushPIN™** assembly. Unlike adhesive-based heat sinks, this uses:
* **Compression Springs:** Provides specific pressure to ensure maximum thermal interface contact.
* **Plastic or Brass Pegs:** Secured through pre-drilled holes in the Printed Circuit Board (PCB).
#### C. Thermal Interface Material (TIM)
The "C2" in the part number indicates that it comes with a **T766 Phase Change Material**. This is an interface layer applied to the base of the heat sink that melts at operating temperatures to fill microscopic air gaps between the component and the sink, significantly improving heat transfer.
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### 3. Application Use Cases
This specific model is typically found in:
* **Telecommunications:** Cooling high-speed switching silicon.
* **Industrial PC (IPC):** Ensuring thermal stability in embedded systems.
* **Power Supplies:** Dissipating heat from MOSFETs or voltage regulators.
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- ⤷
What are the advantages of pushPIN™ over traditional thermal adhesive?
- ⤷ How does the blue anodized finish affect the performance of the heat sink?
- ⤷ What is the specific thermal conductivity of the T766 phase change material?