The **ATS-14B-40-C2-R0** is a high-performance electronic thermal management component. Specifically, it is a **Heatsink** designed for cooling integrated circuits (ICs) and other electronic components. It belongs to the *pushPIN™* series manufactured by **Advanced Thermal Solutions (ATS)**. --- ### 1. Technical Specifications The following table summarizes the physical and thermal properties of the part: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W x H)** | 45mm x 45mm x 15mm | | **Thermal Resistance (Unducted)** | 14.56 °C/W @ 100 LFM | | **Thermal Resistance (Ducted)** | 2.48 °C/W @ 100 LFM | | **Fin Type** | Fine Pitch (Straight Fins) | --- ### 2. Key Component Features * **Heat Sink Material:** Made of aluminum for high thermal conductivity and lightweight properties. * **PushPIN™ Attachment:** This mechanism uses a spring-loaded pin to provide a secure and consistent pressure across the component surface, ensuring optimal thermal contact. * **Thermal Interface Material (TIM):** The part typically comes pre-applied with **T766** phase-change material or similar, which fills microscopic air gaps between the heatsink and the chip. * **Blue Anodized Finish:** This coating improves surface emissivity (radiation heat transfer) and provides corrosion resistance. --- ### 3. Decoding the Part Number The part number follows a specific nomenclature used by Advanced Thermal Solutions: | Segment | Meaning | Detail | | :--- | :--- | :--- | | **ATS** | Manufacturer | Advanced Thermal Solutions | | **14B** | Series | pushPIN™ Heat Sink | | **40** | Length/Width | Specific dimension identifier | | **C2** | Thermal Performance | High-performance fin density | | **R0** | RoHS Status | Compliant with environmental regulations | --- ### 4. Application and Use Cases This component is typically found in: * **Telecommunications:** Cooling networking switches and routers. * **Computing:** Protecting CPUs, GPUs, or FPGAs from overheating. * **Power Electronics:** Dissipating heat from high-speed power modules.